The Raytheon Intelligence & Space (RIS) Advanced Concepts and Technology (ACT) Mission Area seeks an experienced Principal Mechanical Engineer for our McKinney, TX location. The candidate will reside in the ACT Hardware Engineering Directorate and perform mechanical design and documentation of Antennas, Radomes, Radio Frequency (RF) Sensors and Supporting Electronics and Sub-Systems. The candidate will be responsible for guidance in the areas of mechanical design, new pursuits and proposals, requirements development, design concept development and trade studies in addition to hardware design and documentation. The candidate may be responsible for instructing the work of small teams of mechanical engineers within a broader integrated product team (IPT).See More
The candidate is expected to follow established procedures and instructions while working closely with program and functional leadership to ensure that overall design goals are met. The candidate is expected to have experience in the use of solid-modeling CAD software and have multi-year experience in electronics packaging. The candidate is also expected to be experienced in the use of Geometric Dimensioning and Tolerancing (GD&T) for design documentation and fabrication. The candidate will be responsible for developing technical solutions to a wide range of complex problems. The candidate will be responsible for supervising the definitions of mechanical outline and construction details, connector selection and specification, mechanical and assembly drawings, and overseeing electrical layout and the technical data package. Familiarity with ANSI drawing standards is required. The candidate will be also responsible for meeting cost, schedule, quality, and performance requirements for the finished product. The candidate will work with minimal direction or supervision, while exercising latitude in choosing the technical goals of the assignment. The position will require frequent interaction with program management and external personnel.
•8+ years of experience in the design and manufacturing of electronics packaging.
•Must possess a thorough knowledge of GD&T, ANSI drawing standards and first order analysis techniques.
•Ability to travel periodically to suppliers, manufacturing facilities and customer sites to support programs (up to 25%).
•Ability to apply basic principles, philosophies, and concepts within the mechanical engineering field.
•Must have a working knowledge of Microsoft Office (Word, Excel, PowerPoint, Project, Outlook).
•The ability to obtain and maintain a US Secret Security Clearance. U.S. Citizenship is required as only US Citizens are eligible for a security clearance.
•Experience negotiating with internal and/or external suppliers.
•Twelve (12) or more years of industry experience in the design and manufacturing of electronics packaging for military and aerospace applications.
•Solid modeling (preferably CREO).
•Experience with testing of electronics to military environments (MIL-STD-810).
•Experience with radar absorbing materials.
•Experience with polymer matrix composites for radome applications.
•Finite element analysis (preferably Abaqus).
•Excellent leadership skills and project management skills.
•Demonstrated presentation and communication skills.
•Deep desire to mentor earlier career engineers.
•Experience leading proposals and supporting new business development.
•B.S. in a STEM field from an ABET accredited university
•M.S. in Mechanical Engineering from an ABET accredited university
Raytheon Technologies is An Equal Opportunity/Affirmative Action Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability or veteran status, age or any other federally protected class.
Valid through: 9/25/2021