Advanced Micro Devices, Inc

Photonics IC Top Level Integration Engineer

Advanced Micro Devices, Inc$90K — $120K *
Information Technology
Less than 5 years of experience
Job Overview by Ladders

Qualifications

  • 5-7 years experience in photonic integrated circuit (PIC) design and implementation
  • Strong hands-on experience with semiconductor physical design and design automation
  • Proficient in scripting languages such as Python, Julia, SKILL, or TCL
  • Familiarity with photonic and electrical system integration
  • Solid understanding of advanced packaging technologies
  • Experience in physical verification including DRC, LVS, and ESD verification workflows
  • MASc or PhD in relevant fields preferred

Responsibilities

  • Contribute to top-level integration and physical implementation of PICs and co-packaged optical solutions.
  • Develop and maintain layout generation and physical design automation frameworks.
  • Support full-chip physical verification and signoff activities.
  • Perform and analyze EM/IR, power integrity, reliability, and ESD verification.
  • Collaborate with device engineers for production-ready layout integration.
  • Work with various design teams to support system integration.
  • Assist in optimizing design and floorplanning methodologies.

Benefits

  • Comprehensive health coverage including medical, dental, and vision.
  • 401(k) retirement plan with company match.
  • Generous paid time off and holidays.
  • Professional development opportunities and tuition reimbursement.
  • Flexible work arrangements and hybrid work model.
Full Job Description

THE ROLE:

We are seeking a Photonic Integration Engineer with expertise in photonic integrated circuit (PIC) implementation, physical design, verification, and packaging integration. In this role, you will contribute to the development of scalable physical design methodologies, verification flows, and automation frameworks that support successful product tapeouts and high-volume manufacturing.

You will work across photonic, electrical, and packaging domains to help enable robust integration of complex mixed-signal and optical systems while supporting efficient design and signoff processes.

 

THE PERSON:

You are a hands-on engineer with experience in photonic integrated circuits, semiconductor physical design, and design automation. You enjoy working in multidisciplinary environments and have a solid understanding of how photonic devices, electronic circuits, and packaging technologies come together in integrated systems.

You will contribute to top-level chip integration, physical implementation, and signoff activities while collaborating closely with photonic design, electrical design, process technology, and packaging teams. This role involves developing automated layout generation methodologies, improving verification workflows, and helping ensure manufacturability, reliability, and performance across electro-photonic products.

 

KEY RESPONSIBILITIES:

  • Contribute to the top-level integration and physical implementation of photonic integrated circuits (PICs), electro-photonic subsystems, and co-packaged optical solutions.
  • Develop and maintain script-based layout generation and physical design automation frameworks using Python, Julia, SKILL, TCL, or equivalent scripting languages.
  • Support full-chip physical verification and signoff activities, including DRC, LVS, ERC, and photonic verification flows.
  • Perform and analyze EM/IR, power integrity, reliability, and ESD verification.
  • Collaborate with photonic device engineers to integrate waveguides, modulators, detectors, couplers, and other optical building blocks into production-ready layouts.
  • Work with analog, mixed-signal, RF, and digital design teams to support electrical and photonic system integration.
  • Assist in developing and optimizing physical design methodologies, floorplanning strategies, hierarchical integration flows, and tapeout processes.
  • Support package-aware design and verification activities, including optical packaging, fiber attach strategies, thermal management, signal integrity, and co-packaged optics architectures.
  • Contribute to automation infrastructure, verification methodologies, and design best practices across photonic and electrical design environments.
  • Support silicon bring-up, root-cause analysis, and correlation of physical design assumptions with silicon and module-level test results.

 

PREFERRED EXPERIENCE:

  • Experience in photonic integrated circuit (PIC) design, physical implementation, and top-level integration in production or advanced R&D environments.
  • Experience with physical design and implementation tools such as Cadence Innovus, Virtuoso, and related semiconductor design environments.
  • Experience developing script-based layout generation and design automation frameworks using Python, Julia, TCL, SKILL, or equivalent programming languages.
  • Understanding of physical verification methodologies, including DRC, LVS, ERC, and photonic verification flows.
  • Familiarity with EM/IR, power integrity, reliability, and ESD verification.
  • Knowledge of silicon photonics technologies, photonic device integration, and electro-photonic system architectures.
  • Understanding of advanced packaging technologies, including co-packaged optics, optical module integration, fiber attach methodologies, thermal management, and heterogeneous integration.
  • Experience collaborating with photonics, electrical, packaging, process, and manufacturing teams.
  • Exposure to silicon or photonic product tapeouts is considered an asset.

 

ACADEMIC CREDENTIALS:

  • MASc or PhD in Electrical Engineering, Photonics, Optics, Applied Physics, Semiconductor Engineering, or a related discipline preferred.

 

LOCATION: Markham, ON

 

 

 

 

 

 

 

 

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Learn more about Advanced Micro Devices, Inc
Size
15,500 employees
Market Cap
$100.9 billion
Industry
Net Income
$2.4 billion
Founded
1969
5 Year Trend
+30.9%
Revenue
$9.7 billion
NASDAQ

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