Optical Assembly Process Engineer

Ciena   •  

Ottawa, ON

Industry: Telecommunications


5 - 7 years

Posted 179 days ago

This job is no longer available.


We believe in the power of people. We are a network strategy and technology company that is motivated by making a difference in people’s lives – their productivity, their creativity, their health and comfort. That’s why our engineers design and implement technologies that allow people to do great things.

Ciena is seeking an Optical Assembly Process Engineer to work within the New Product Introduction group of the Optical Components R&D organisation.  Working closely with our Design team and manufacturing partners, the Optical Assembly Process Engineer shall act as the lead for providing manufacturability feedback (DFx) for new products within R&D and work with the various parties to plan and action the development of assembly processes and equipment capability for Ciena’s optical component products.  They will further be involved in the transfer of those capabilities to our contract manufacturer (CM) and then maintain and improving them in production.

This position requires a significant amount of travel to support Ciena products at our contract manufacturing partner, and through our supply chain.

Responsibilities generally include, but not limited to:

  • Provide the process expertise and direct process related feedback within the packaging development team to ensure micro-optoelectronics products are designed for manufacturability.
  • Assist in developing design rules that facilitate inspection, testing, and create reliable assembly practices
  • Develop new and implement standardized methods, operation sequences and processes in the assembly of optical components, sub-assemblies and final assemblies
  • Develop experiments to verify design concepts during concept and detailed design phases using assembly and test equipment
  • Review product requirements with program team to ensure compatibility of processing methods
  • Specify and/or validate new equipment for various assembly processes
  • Design, develop, and implement cost-effective methods of manufacturing new products. Improving existing and developing new process ideas to perform Design of Experiments (DOE) and process validation
  • Maintain process related engineering records and prepare reports of findings, developments and recommendations
  • Create or modify programs/scripts for automated assembly equipment
  • Develop new or modified process formulations define processing or handling equipment requirements and specifications, and review processing techniques and methods applied in the manufacture, fabrication, and evaluation of the product
  • Generate detailed workflows (Work Instructions) for complex mechanical and optical assemblies
  • May be responsible for initiating, overseeing and driving the qualification of new products and processes prior to release to production
  • Assist in the design of assembly fixtures for die attachment, optical assembly and component placement
  • Design of component transport trays and packs for the die handling and attachment
  • Carry out verification in the form of metrology and document results
  • InP die attachment process development
  • Development of processes compatible with the assembly equipment
  • Development of assembly-level tests to assess the quality of the products in a high-volume operation
  • Monitor process data on an ongoing basis and report on yield, throughput, and defect occurrence rates

Required Qualifications

This position requires a candidate with a strong, demonstrated record in the development and manufacture of advanced optoelectronic modules and devices in a telecom or Datacom environment.  This position will involve a higher than average level of travel (estimated at around 33%) to support the products during transfer to the CM and maintain the product in manufacture.

Skills and Experience

  • A minimum of a Bachelor’s degree in a relevant discipline and 5+ years product experience in the design, manufacture or test of optoelectronic products
  • Excellent organisational and project management skills
  • Understanding of Product Lifecycle Management
  • Demonstrated track record of launching complex optoelectronic module products to market
  • Problem solving and the ability to solve technical issues in a high-pressure environment and resolve issues locally and remotely
  • Experience working in a global marketplace
  • Experience interacting with multi-functional, multi-locational teams
  • Good written and oral communication skills
  • Strong computer and analytical skills, including database management and data analysis tools
  • Knowledge and experience of the production processes related to the manufacture of optoelectronic devices, including,
  • Micro/optoelectronic packaging and assembly technologies
  • Passive and Automated optical alignment
  • Fiber/Receptacle alignment and fixing
  • Laser Welding
  • Die bond (Epoxy and Solder Die Attach)
  • Wire bond (Ball and Wedge)
  • Automated pick and place
  • Micro Welding & Bonding Principles
  • Seam sealing and associated testing
  • Optical alignment equipment
  • Common optical assembly materials and adhesives
  • Determining process capabilities (e.g. Cpk)
  • Optical and electrical test and measurement equipment and tools
  • Verification in the form of optoelectronic related metrology
  • Industry standard qualification and reliability requirements (MIL-STD, Telcordia)
  • Soldering processes
  • Design of experiments
  • Manufacturing automation
  • Mechanical design with AutoCAD or SolidWorks