NAND Assembly Test Quality and Reliability Engineer
- Job Number: 52469345
- Santa Clara Valley, California, United States
- Posted: Sep. 15, 2017
- Weekly Hours: 40.00
In your role as an Apple NAND Assembly Test Quality and Reliability Engineer as part of NAND Hardware Development Team, you will conduct quality assessment (up to and including semiconductor vendor/CM sites audit) and perform statistical analysis to determine the responsibility for NAND and MCP products that do not meet required specifications. In addition, you will involve in determination of quality and reliability requirements of NAND and MCP to help define Apple's mass storage solutions for our current line of world class products as well as have direct technical impact on what our future product capabilities will be. This is a unique opportunity to showcase your skills in NAND memory package assembly, test, and system design. In this role you will leverage your career success and technical depth in managing external suppliers and driving items to closure across large cross-functional teams. At Apple we hire champion for quality and best-in-class product solutions.
- Typically requires 7+ years in NAND flash memory assembly and test experience
- Strong Flash Quality and Reliability experience
- Experience with semiconductor package and test engineering
- Strong Flash technical background
- Experience with NAND flash memory technology and processing is a plus
- Experience with system level NAND flash engineering is a plus
- MS or BS Degree in technical discipline.
NAND Assembly Test Quality and Reliability Engineer should have past experience with several of the following activities: •Responsible for communicating NAND vendors regarding NAND package and test related quality excursion, failure analysis, and corrective actions •Managing vendors NAND package qualification, manufacturing quality systems and methods, PCN control, Material Review Board for lot disposition, and Audit •Demonstrate strength in technical and analytical problem solving skills for package and test related any quality issues •Support internal engineering and management teams in NAND package and test related failure analysis and defining corrective actions •Develop analytical tools and quality screens to assure the early identification of potential problems with new NAND products and new NAND MCP packaging •Creating and maintaining a failure analysis workflow including CM’s, vendors, and internal teams
•MS Degree in technical discipline.