Perform mechanical packaging design and analysis of space flight electronics units. Generate mechanical fabrication drawings, assembly drawings, interface control documents, and procedures as required across various products and programs. Maintenance and revision of engineering drawings, parts lists, procedures will be performed accurately and expediently in a fast pace work environment. Candidate should have a good working knowledge of dynamics and thermal effects and be capable of performing basic structural and thermal analysis/hand calculations to ensure critical electronic components will survive the required operational and test environments. Design basic fixtures and tooling required to facilitate manufacturing and integration of products. Ideal candidate will have experiencesupporting vibration, shock, and thermal vacuum testing. Job requires good verbal and written communication skills, working in a team environment, to ensure projects are executed quickly and accurately.
Knowledge and experience with electronics packaging or similar experience.
Knowledge and experienceworking with 3D CAD and Simulation software (Solidworks experience is preferred).
Understanding and application of GD&T and tolerancing practices and implementation on drawings.
Understanding and experience with Stress and Thermal Analysis. Experience with application of Steinberg component fatigue methodologies is preferred.
Understanding of documentation/configuration management best practices.
Understanding and experience with manufacturing, machining and fabrication best practices. Experience with electronics manufacturing and soldering practices is preferred.
Understanding and experience with adhesives, bondings, and coatings is preferred.
Basic understanding of electrical engineering concepts is preferred.
Education and Work Experience Requirements:
B.S Mechanical or Aerospace Engineering with 5+ years of work experience in electronics packaging or similar work experience.