Location: Chandler, AZ or Vancouver, WA
Hybrid: 3 days a week onsite
About the RoleWe're a fast-moving startup building the foundation for next-generation AI compute. We are seeking a hands-on technical leader to develop the next-generation thermal management solutions for advanced power delivery chiplet technologies targeting AI/data center platforms. This role is at the intersection of semiconductor packaging, thermal architecture, mechanical integration, and high-volume manufacturing. You will work closely with internal silicon, package, reliability, and operations teams, while interfacing directly with Tier-1 customers, OSATs, substrate vendors, material suppliers, and ecosystem partners.
You will develop novel thermal solutions spanning:
- Landside cooling architectures
- Embedded thermal structures integrated into substrate cores
- Novel package-level thermal integration concept
What You'll Do- Drive thermal-mechanical co-design across chiplet, package substrate, cold plate, heatsink, and system-level integration.
- Collaborate with package design teams to optimize stack-up, warpage, stiffness, CTE management, and assembly robustness.
- Evaluate emerging cooling technologies including direct-to-chip liquid cooling, embedded cooling, vapor chamber integration, and advanced TIM solutions.
- Perform detailed thermal and thermo-mechanical simulations using industry-standard tools.
- Define integration strategies enabling customer adoption of novel thermal solutions into final package assembly flows.
- Collaborate with OSATs, substrate suppliers, thermal solution vendors, and manufacturing partners to enable scalable deployment.
What You Bring- MS or PhD in Mechanical Engineering, Thermal Engineering, Materials Science, or related field.
- 10+ years of experience in semiconductor thermal engineering, advanced packaging, or high-performance computing systems.
- Experience with thermal and thermo-mechanical simulation tools such as ANSYS, Icepak, COMSOL, Abaqus, or equivalent.
- Experience developing thermal solutions for high-power semiconductor devices or advanced packaging applications.
- Strong understanding of reliability physics including warpage, CTE mismatch, TIM performance, and thermal cycling.
- Knowledge of package assembly processes, substrate manufacturing, and OSAT workflows.
Compensation & BenefitsAnticipated annual base salary: $175,000 - $225,000
- Comprehensive benefits package including health, dental, vision, and 401(k)
