Infinera - High Speed Board Design

Larsen & Toubro  •  Sunnyvale, CA

5 - 7 years experience  •  Engineering Services

Salary depends on experience
Posted on 12/01/17 by Bajrang Yadav
Larsen & Toubro
Sunnyvale, CA
5 - 7 years experience
Engineering Services
Salary depends on experience
Posted on 12/01/17 Bajrang Yadav

·        Develop advanced high density printed circuit board (PCB) for Infinera’s next generation coherent PIC (Photonic Integrated Circuit) and DSP modules

·        Design, simulate, analyze, characterize electrical performance of the above electronic circuits

·        Write with clarity detailed hardware functional specification, test plan, and test reports

·        Supervise PCB placement and layout

·        Work closely with cross functional product development teams in PIC module, ASIC, firmware, mechanical, and test software

In addition, the successful candidate will have a specific focus towards high speed serial link (SerDes) architecture and circuit assignments. These include:

·        Design, layout, and thorough System HW characterization of high speed Integrated SerDes circuits in various channel environments spanning multiple PCBs and high speed connectors

·        Evaluation and selection of SerDes interconnect PHY topologies, transmitter and receiver capabilities, parameter tuning, and related clocking / power supply considerations to meet critical performance and robustness objectives

·        Development and documentation of hardware requirements and specifications for system switch fabric architectures and subcomponents (chassis and card).

·        Perform circuit simulation, in-lab testing, and methodical characterization of SerDes circuits

·        Design with high emphasis on noise, jitter, and signal crosstalk suppression

·        Design with high emphasis on compact size/miniaturization appropriate for dense boards with multiple optical/electronic channels in parallel.

·        Work with and drive suppliers to optimize tuning parameters and perform root cause/corrective action of defects and under-performing links. Suppliers would include both external vendors and internal (INFN ASICs).

Scope a project and technically manage it across organizational boundaries. Needs good communication skills and ability to analyze/present data and determine/drive next steps. High Speed Serial link Board design - Extensive experience in high density, miniaturized PCB design for the high speed analog, digital, and power electronic circuits used for coherent optical transmitter and receiver modules

·        Past experience in electronic circuit design of optical transceiver modules such as CFP2, CFP, QSFP, XFP is desirable

·        Fundamental understanding of circuit theory, linear system theory, electronic noise suppression, transmission line theory

·        Proficiency with one or more engineering tools like ICAP, Matlab, PSPICE, Cadence PCB SI, and lab measurements such as VNA and TDR

·        Experience of designing and debugging SerDes circuits with Tx pre-emphasis and Rx equalization techniques

M.S. or B.S. degree in electricalengineering or physics with minimum 5 years of industry experience

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