Electronics Packaging Structural Technical Expert

 •  Aerospace El Segundo, CA

11 - 15 years experience  •  IT Consulting/Services

Salary depends on experience
Posted on 08/15/17
El Segundo, CA
11 - 15 years experience
IT Consulting/Services
Salary depends on experience
Posted on 08/15/17

Responsibilities

Component Analysis and Test is seeking a self-motivated employee that will have a strong work ethic, technical leadership and the capability to bring innovative solutions to the table. The successful candidate will act as a technical expert with regard to structural analyses of a wide variety of complex electronic packaging of piece parts, modules, and units for launch and space systems. They will independently participate, coordinate, and lead multi-disciplinary teams, as needed, to assess mission risk, determine failure root cause and assess design margin for all manner of electronics packaging.  The successful candidate will also provide mentoring and technical leadership to less experienced team members. Continuous development and refinement of analysis methodologies used by the team is also expected.


Analysis support will be provided through all phases of the program life-cycle from proposal, to conceptual design, design development, assembly, test, launch, and mission operations. Anomaly resolution and root cause investigation support will comprise a significant portion of the workload, and will include the quantification of risk through the application of statistical methods to analysis and life test results. Analyses will evaluate the structural integrity of all types of electronic systems for strength, stiffness, and fatigue life due to dynamic excitation and thermal environments. Results will also be used to define accelerated life tests. Advanced analysis techniques using non-linear methods will also be required to address plasticity, creep, temperature dependent material properties, and residual stress resulting from assembly processes.

 

Key Functions

  • Conduct specialized technical studies to assure the integrity and stability of electronics packaging subjected to static, dynamic, and thermal loads using closed-form, semi-empirical, and finite-element analysis tools
  • Apply analytical and empirical models to define accelerated testing parameters and perform fatigue-based risk assessments for electronic units and sub-assemblies
  • Review and provide technical assessments of structural and fatigue analyses, risk assessments, and accelerated life test requirements developed by contractors for electronic units, their sub-assemblies, and related hardware
  • Possess and maintain state-of-the-art skills in activities related to requirements, design, evaluation, and testing of electronics packaging
  • Communicate with line management, inter-organizational personnel, program office, and customer points of contact to scope, plan, and resolve technical issues
  • Maintain detailed records of work performed and commonly used analysis inputs such as material properties, generic model components, and methodologies
  • Document analyses and reviews in chart packages and reports as appropriate
  • Maintain flexibility in changing priorities and working hours to support business needs
  • Provide mentorship and analysis guidance, scoping and leadership to less experienced team members
  • Develop and refine analysis methodologies and practices for use by the team

Qualifications

Required

  • Bachelor’s degree in engineering focusing on structural mechanics or a closely related field
  • Ten or more years of experience in positions of increasing responsibility related to structural mechanics engineering
  • Three or more years of experience performing structural analysis of electronics packaging
  • Advanced knowledge of finite element analysis (FEA) using commercial software packages and the underlying theory
  • High levels of innovation, creativity, and initiative
  • Ability to formulate and perform closed-form solutions and other hand calculations to evaluate the structural integrity of a system and/or to verify finite element results
  • Ability to solve unique and challenging structural problems by applying critical thinking skills and a working knowledge of scientific principles, theories and concepts
  • Ability to understand detailed engineering drawings, CAD models, and specifications
  • Excellent written and verbal communication skills with an ability to clearly and concisely communicate technical information to customers
  • Demonstrated ability to establish and maintain effective working relationships with co-workers, customers, and contractor personnel
  • Experience with the Microsoft Office software suite (Word, Excel, Powerpoint, Outlook)
  • Ability to travel to contractor locations, as required
  • Ability to obtain and maintain a security clearance, which is issued by the U.S. government
  • U.S. citizenship is required to obtain a security clearance

 

Preferred

  • Existing DoD Security Clearance, with SSBI (TS/SCI)
  • Advanced degree related to structural mechanics with an emphasis on the structural analysis of electronics, from an accredited university
  • Extensive knowledge of electronics packaging principles and practice, including basic electronic part package styles, attachment mechanisms, materials, and processes
  • Extensive knowledge of the strengths and weaknesses of linear and non-linear FEA and commercial finite element software tools
  • Experience using Abaqus, NASTRAN, or other commercial finite element software
  • Knowledge of the principles and application of random vibration and other dynamic analysis and testing
  • Knowledge of the material science fundamentals, as related to determining mechanical properties of metals, metal alloys, polymers, and ceramics used in electronics packaging
  • Experience developing accelerated life tests
  • Experience using statistical methods used to characterize the structural reliability and probability of failure
  • Capability to develop advanced structural analysis, test, and materials characterization techniques
  • Willingness to learn and develop new analysis techniques, methodologies, approaches and software tools.
  • Leadership skills with the ability to drive a small team towards practical engineering solutions.

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