Electronics Packaging Process Engineer
Less than 5 years experience • Business Services
Seeking experienced Process Engineer familiar with wire bonding, solder attach, polymer encapsulation and potting, wafer dicing, etc.
*** Develop electronics packaging production processes such as wire bonding, die attach, vacuum reflow soldering, dicing, etching, potting, curing, etc.
*** Develop and conduct statistical analysis such as Design of Experiments and Statistical Process Control targeting process optimization and high yield process controls for specific electronics packaging manufacturing processes.
*** Recommend and implement equipment and process modifications to improve production efficiencies, manufacturing techniques and production yields for existing products and processes, and lead setting up such equipment.
*** Interact with product design engineers to ensure that processes and designs are compatible and optimized for future products.
*** Provide technical and engineeringsupport to the manufacturing team.
Dynamic organization offers high growth potential, industry competitive compensation package, bonuses, full medical benefits, 401(k) retirement plan, generous vacation time, numerous career development opportunities, and more!
Please reference #37235502 when responding.Education Requirements: Bachelor DegreeMinimum Experience Requirements: 2-5 yearsJob City Location: New BrunswickJob State Location: NJJob Country Location: USASalary Range: $80,000 to $120,000
WE ARE AN EQUAL OPPORTUNITY EMPLOYER and our employment decisions are made without regard to race, color, religion, age, sex, national origin, handicap, disability or marital status. We reasonably accommodate individuals with handicaps, disabilities and bona fide religious beliefs. Jobs Career Position Hiring. CONSIDERED EXPERIENCE INCLUDES: Top 10 Job Site Top 10 Careers Site Process Engineer Manufacturing Semiconductors Laser Diodes Etching Inductively Coupled Plasma Etching Reactive Ion Etching Ion Mills Scanning Electron Microscopes Focused Ion Beams Atomic Force Microscopy Profilometers Photonic Integrated Circuits PICs
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