Electrical Engineer, Packaging Design at Rigetti in Fremont, CA

As an Electrical Engineer on the Rigetti Packaging team you will design, build, and validate hardware that forms the signal chain for control and readout of our quantum computing system, especially in the milli-kelvin cryogenic vacuum environment where the superconducting qubits operate. This involves design of printed circuit boards (PCBs) and selection of components for DC and RF signals up to 10 GHz, selection of materials and fabrication processes to balance competing electrical and thermal conductivity requirements, and working with component manufacturers, PCB fabrication suppliers, and electronic assemblers to ensure that manufactured components perform reliably as intended. You will be working closely with a team of electrical engineers, mechanical engineers, and physicists to define system and component requirements, and integrate your designs into functional customer-deployed quantum computers. As scientific and engineering leaders, we value diversity and are committed to building a culture of inclusion to attract and engage innovative thinkers. Our technology, meant to serve all of humanity, cannot succeed if those who built it do not mirror the diversity of the communities we serve. Applications from women, minorities, and other under represented groups are strongly encouraged.

As scientific and engineering leaders, we value diversity and are committed to building a culture of inclusion to attract and engage innovative thinkers. Our technology, meant to serve all of humanity, cannot succeed if those who built it do not mirror the diversity of the communities we serve. Applications from women, minorities, and other under represented groups are strongly encouraged.

Preferred Qualifications:

• Experienced user of electrical CAD software for schematic and layout design (Altium preferred).
• Understanding of design requirements for performance of RF analog signal routing, including impedance control and crosstalk mitigation.
• Detailed practical understanding of multi-layer and HDI printed circuit board manufacturing and assembly processes and tradeoffs.
• Familiarity with mechanical packaging interface requirements and tolerances.
• Experience with lab equipment including vector network analyzers for performance characterization and troubleshooting of RF circuits.
• Experience collaborating with electrical fabrication and assembly vendors and supplier quality engineers to perform root cause analysis of failures and develop corrective action plans .
• Ability to design and characterize test procedures for electrical components, and perform meaningful analysis of the resulting data.
• Familiarity with revision-control and documentation-control processes.
• Excellent communication skills and an ability to interact across different disciplines.

Ideal Qualifications:

• Familiarity with superconducting materials and behavior.
• Knowledge of parametric design techniques for PCB layout CAD automation.
• Familiarity with mechanical CAD software for collaboration (SolidWorks preferred).
• Familiarity with soldering process design for PCB assembly.
• Familiarity with wire-bonding process design.
• Familiarity with 3D electromagnetic finite-element modeling (FEM) using HFSS or similar tools.
• Exposure to metrology tools in semiconductor fabrication environments.
• Python scripting (especially including e.g. numpy and scipy for scientific computing) for analysis and equipment automation.
• Demonstrated experience pushing the boundaries of industry-standard fabrication processes.

About You:

• BS degree or higher in Electrical Engineering or equivalent.
• 5+ years of relevant industry experience.