Director, Product and Test Engineering

15+ years experience  • 

Salary depends on experience
Posted on 03/21/18
San Jose, CA
15+ years experience
Salary depends on experience
Posted on 03/21/18

eSilicon is seeking a semiconductor manufacturing engineering executive to manage and lead a global team, and solve both engineering and system integration challenges.

This technical leader will interact directly with customers through all phases of the product cycle from pre sales to post production aligning customer requests/requirements with business goals. Plan and execute on New ASIC Product Introduction on latest Technologies and drive Cost Reduction on new and mainstream technologies collaborating closely with and leading efforts among product, test and foundry teams.  Reporting to the VP Of Semiconductor Services, this technical leadership role is based in San Jose, CA.

The ideal background includes 15+ years of demonstrated experience in Semiconductor (IC) Manufacturing/Product Engineering management in fast-paced, dynamic semiconductor companies. The right candidate will possess a track record of successfully leading globally dispersed teams and scaling resources to business needs including:

· Effectively lead and manage Product Engineering

· Lead best in class automated test and characterization systems

· Establish standard and automated characterization for new products

· Manage product resources, including hiring, training, project assignment, and people management including Product-related continuous improvement projects

– Manage New Product Introduction (NPI) Strategy globally

– Manage production sustaining activities globally

– Interact heavily with sales, ASIC design, executive management, and internal and external customers

– Manage yield management for the company, tools strategies, disposition, yield improvement programs

– Manage Wafer Foundry Engineering, work directly with eSilicon Foundry partners

– Responsible for driving foundry yield improvement  

Requires 15+ years semiconductor related Product and Test leadership experience as described above including: 

· Extensive knowledge of the chip business from Design to IP to semiconductor manufacturing

· Connecting the entire value chain and the interdependencies is critical

· On-time Test/Characterization delivery for relevant devices

· Demonstrable understanding of foundry related processes and what can impact performance and yield

· Solid understanding of packaging technologies, device and package reliability

· Detailed understanding of test programs, characterization metrics and methodology

· Understands test time reduction methods, and ROI calculation of achieving optimum test cost

· Relevant expertise in Semiconductor Test, Manufacturing (Digital ASIC/ASSP) and Foundry operations

· Self directed, capable of managing complex projects, working individually and leading other technologists to achieve objectives

· Demonstrated experience in New Product Introduction (NPI) and Characterization

· Proven capability in yield management and cost reduction

· Prior experience in automation of bench characterization at multiple insertions

· Proven ability to effectively work as part of an ad hoc cross functional team as needed

· Excellent organization and time management skills

· Excellent Supplier management skills

· Understanding of financial measurements

· Proficient at Excel

· Accessible, collaborative, confident, creative, flexible and dynamic

· Well regarded by colleagues, customers and staff

· Quality and customer success orientation

· Highly analytical and demonstrated success in relevant investment and cost analysis

· Strong Knowledge in Volume Test Manufacturing

· Strong influencing and problem solving skills

· Strong data analysis skills and familiar with statistical tools

· BS/MS EE

Preference for those who have led technical teams possessing: 

· hands-on ATE experience in Teradyne and Advantest Digital Platforms

· DFM, DFT, BIST, JTAG validation, and verification

· package design familiarity

· signal integrity expertise

· experience in 28nm and 16/14nm New Product Introduction a plus

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