Would you like to be part of the latest E-beam metrology equipment development forsemiconductor applications? We are looking for adigital IC design engineer to beresponsible forengineering ofanalog anddigitalcomponents of the E-beam metrology tool.
Hermes Microvision, Inc. (HMI), an ASML company, is a leading supplier of advanced E-beaminspection and pattern verification systems used for advancedsemiconductor devices. HMI has multipleyears of e-beam applicationexperience and leadership insemiconductor factories, focused on high resolution andvoltage contrast imaging. As part of ASML, HMI will boost ASML’s holistic lithographicportfolio of (i) lithography exposure systems, (ii) computational lithography and (iii) metrology. Between these three cornerstones ASML offers application products for process window enhancement, control and detection. As part of our team, you will have the opportunity to go beyond yourself in developing more advanced techniques and pushing the boundaries oftechnology.
• Work with partners on the design process of thedigital components. • Together with the designengineering team from the partners, identify design solutions for the specifications of the module / function. • Conduct schematic level, layout level verification of the designs. • Work closely with the partner to conduct function / performance tests and verification after tape out. • Support the sub-system level integration. • Generate and / or review related IP documents.
Ph.D. with 2+years of hands-onexperiences, ormaster with 5+years hands-onexperiences, orbachelor with8+years hands-onexperiences, inelectricalengineering. Hands-onexperiences ofanalog IC design, layout, verification, tape out, and testing. Familiar with Bipolar, CMOS, and BiCMOS process. The successful candidate should be a team player and should have self motivation, initiative, dedication, and strong communication skills. The candidate should also have the following specific skills orexperiences.
• CPLD and FPGA IC design, layout, verification, tape out and test • Micro controller IC design, layout, verification, tape out and test • High speed SerDes design, layout, verification, tape out and test • High speed optical fiber transceiver IC design, layout, verification, tape out and test • High speed clock distribution and deskew IC design, layout, verification, tape out and test