Customer Solutions Pre-Sales Engineering ( ASIC, IP, Packaging )

eSilicon   •  

San Jose, CA

11 - 15 years

Posted 243 days ago

This job is no longer available.

Responsibilities include:

  • Primary customer interface for all technical support activities during the Pre-Sales Process.
  • Represent eSilicon technical expertise in front of current and potential customers.
  • Work closely with eSilicon Sales, Marketing, and Technology groups to craft proposed solutions for Customers.
  • Align with IP suppliers to understand their products and benefits to eSilicon customers.  Work with customers and IP suppliers to target best solutions.
  • Work with IP supplier on custom solutions or road map development as needed.
  • Analyze eSilicon solutions as they relate to competition.
  • Work closely with Marketing to adjust proposals or roadmaps as needed.
  • Develop technical presentations.
  • Understand and continue to develop our technical and commercial differentiation


Excellent communication Skills:

  • Must have excellent written and presentation skills
  • Well regarded by colleagues as a self starter with superior ability to craft solutions to complex problems with little to no input.

Very familiar with ASIC process technology:

  • Different technology nodes and relevant features.
  • Experience with multiple foundries, with emphasis on TSMC.
  • Experience with advanced process nodes – 28/16/14/7nm.
  • Experience in large, complex design
  • Key performance metrics
  • Fabrication process
  • Prototype bring up
  • Production Qualification process
  • Knowledge of FA a plus
  • Experienced in ASIC Physicaldesign.
    • Timing analysis using STA
    • Floorplanning
    • Place and Route
    • Clock tree architectural decisions and implementation
    • Timing closure
    • Timing Signoff  Methodology
    • Low power techniques
  • Experienced in ASIC Design For Test
  • Understanding of ASIC handoff processes
  • Knowledge in IP
    • Familiar with foundation IP (Standard cell libraries, IO, memory, PLL)
    • Familiar with common hard IP blocks (SerdDes, MXS, processors)
    • Familiar with common soft IP blocks (memory controllers, SerDes controllers.)
  • Package
    • Familiar with broad range of package technology
    • Can work with package engineering to select cost competitive solutions.
    • Familiar with package and board level Signal Integrity analysis

Education and Experience:

  • BS EE Degree
  • Minimum 10 years experience in ASIC industry