Mechanical Engineer

Industry: Engineering Services


5 - 7 years

Posted 358 days ago

Job Summary: Perform conceptual design, platform integration and mechanical analyses for phased array radar, EW and communications antennas, and associated technologies for ship, air and ground mobile applications.
Duties (Listed in order of importance with the estimated amount of time spent at each task):

  1. Work in multi-disciplined team environment to develop new technology and design approaches that enable lower cost and improved performance in next generation phased array antenna systems. (20%)
  2. Work with RF & Systems engineers to perform requirements trades and validate feasibility.  Participate in trade studies to recommend technical approaches that meet sponsor needs in advanced radar, EW and communications systems. (20%)
  3. Work with sponsors, prime contractors, platform managers and shipyards to develop platform integration approaches.   (20%)
  4. Evaluate new technologies in packaging, thermal management, structures and materials for applicability to phased array antennas.   (10%)
  5. Develop and execute risk reduction tasks.   (10%)
  6. Develop and validate environmental, mechanical and mobility requirements for next generation active array radars, EW and communications systems. (10%) 
  7. Perform structural and thermal analysis to develop and validate hardware designs. (10%)


Required Qualifications:

  • BS Mechanical or Aerospace Engineering with 5+ years experience in structural and/or thermal analysis and/or platform integration (or equivalent).  Must have strong analytical background with experience in finite element analysis. Requires excellent communications and interpersonal skills and the ability to work within multi-disciplined teams.  Ability to obtain a Secret clearance.

Desired Qualifications:

  • MSME with 3+ years’ experience and  5-10 years’ specific domain experience in design of phased array antennas for shipboard, ground mobile or airborne applications, and experience in antenna system to platform integration.  Experience in RF electronics packaging design, fabrication processes, advanced thermal management and/or composite materials.