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    Vinayak Pandey

    Chandler, Arizona

    Vice President, Product & Technology Marketing / Field Application Engineering

    STATS ChipPAC Inc

    Specialties

    Brand Marketing & Management

    Communications & PR

    Marketing Research & Analysis

    Digital Marketing & Social Media

    Editorial & Content Management

    Media Production & Broadcasting

    Design & UX

    Where I've Worked

    Jul 2005 – Jan 2008

    Senior Packaging Engineer, Mobile Platforms Group

    Intel Corporation

    2000 – 2005

    Packaging/Design Engineer, Assembly Technology Development

    Intel Corporation
    S

    2013 – 2015

    Vice President/Senior Director Flip Chip Product Line

    Stats CHIP Pac
    S

    2008 – 2011

    Product Line Manager/Senior Manager Flip Chip PoP and Stacked Die Products

    Stats CHIP Pac
    S

    2011 – 2013

    Director, Business Management

    Stats CHIP Pac
    S

    2015 – Present

    Vice President, Product & Technology Marketing / Field Application Engineering

    STATS ChipPAC Inc
    Where I've Studied

    2007

    MBA, Business

    Arizona State University

    2000

    MS, Engineering Mechanics

    Virginia Tech

    1997

    BS, Mechanical Engineering

    IIT-BHU

    Ask Me About

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    STATS ChipPAC Inc

    In the Media

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