You will be a member of a team that will be developing highly complex software systems for semiconductor assembly equipment In this self-steering team, you'll work on realization of the software through a scrum based, agile way of working.
Review and provide input for requirements, create test plans, write test specifications, participate in manual and automated testing, analyze and interpret results, problem reports and change requests.
Develop and/or improve system capabilities on the wedge bonder equipment through innovative design and test methodology; develop insight and understanding of the market for wedge bonding and its adjacencies.
Ensure mechanical components/assembly's have been optimized for performance, cost, and manufacturability; participate in design reviews, and ensure mechanical designs are in line with company standards and object.
Analog designs consisting of digital front end interface, D/A converters, various gain & filter stages, feedback from various sensors & encoders, interfacing A/D converters, piezo drivers, power amplifiers.