The IT Finance Lead, Business Systems, will report to the Solution Delivery Leader, Enterprise Systems & MDM, and will partner with Cree's Finance business organizations to align the delivery and operations of IT solutions to Finance business strategies and objectives. This role will serve as a IT point of contact/partner to corporate Finance as well as Divisional Finance stakeholders.
This person will be a primary contributor to the startup of a new SMT production line for LED PCB Assembly. This position will be responsible for all aspects of printed circuit board assembly, from setup and installation of new equipment, to ensuring high quality product is delivered for top-level fixture assembly.
A successful candidate will be a resourceful problem solver that is able to work around technical obstacles, implement practical solutions and successfully partner with the Cree's worldwide design, project management and manufacturing organizations.
In this position, you will have the opportunity to develop Power and RF semiconductor components for a wide range of applications, where we are expanding our operations due to the high demand for our diverse product lines. You will work with a team of engineers, and technicians to maintain high quality standards in a continuous improvement environment where there is opportunity for growth and advancement.
The essential functions listed are typical examples of work performed by positions in this job classification. They are not designed to contain or be interpreted as a comprehensive inventory of all duties, tasks, and responsibilities. Employees may also perform other duties as assigned.
Ensure the accuracy of payroll, including: base pay, overtime, shift differentials, equity awards, bonuses, payroll taxes, deductions and garnishments in accordance with company policies and government regulations.
Own, manage and drive the Power New Product Introductions through the Business Gate approval process, from Concept through Commercialization. Products include Schottky and MOSFET die, Schottky and MOSFET packaged parts, and Power Modules.