In this role, you will define and develop products from concept through production, working with cross - functional development teams. The selected candidate will require a detailed approach to experimental procedure, analysis and design simulation design.
In this role, the selected candidate will develop and maintain analytical systems, models and procedures in order to support design solutions and enhance time/consistency/safety/efficiency and operability, including a cost metric report for the department.
In this role, you will be working with a multidisciplinary team of optical, electrical/RF engineering, reliability engineering, layout, documentation, manufacturing/process engineering and test engineering, to design modules and microelectronic packaging solutions to customers specifications.
In this role, the selected candidate will be responsible for working collaboratively on various telecommunications projects with engineers, construction teams and designers to assist in the process of providing high quality deliverables to our clients.
The selected candidate will participate in all facets of the design and development including designing the chip components and associated VHDL, collaborate with the fabrication facilities to address questions and/or concerns, designing the chip packaging and collaborating with the packaging facility to ensure the chips are packaged to specifications, designing the test board to evaluate the chip, and collaborate with the board manufacturer to ensure the packages are correctly installed.
In this role, the selected candidate will design and develop NDT solutions, including Ultrasound, Eddy Current, and Remote Visual Equipment; develop and validate on-board FPGA RTL signal processing code in VHDL using offline simulation and in-situ validation tools.