In this role, you will be interfacing with internal and external (OSAT) engineering teams to enable overall development and qualification efforts (i.e. process window experiments. utilizing DoEs, wafer probe/test, reliability testing).
In this role, the selected candidate will serve as a packaging developer in support of innovation, cost savings and business continuity projects; this position will serve as a contributing member of cross functional business teams.
In this role, you will works across functions, interacts effectively with teams such as supply chain, quality assurance, engineering, artwork and regulatory affairs groups to provide input into packaging, packaging components and labeling configuration/options.
In this role, you will be responsible for support all CPI (Chip-to-Package Interaction) activities for RF products that are manufactured in East Fishkill and Burlington. In addition, other packaging projects within the company will be supported as needed.
The successful candidate will have experience with some or all of the following: die bonding of high power diode laser bars, low smile diode laser bars, wire-bonding, processes including different types of solder including gold-tin (AuSn) eutectics and indium solder, development of void-free solder processes, reflow solder processes, design of heat-sinks and heat-spreaders, and design of experiments methodology.
In this role, the selected candidate will plan, execute and document results of design evaluation and analysis for new packaging technologies to ensure products can be successfully effectuated within the Global company system.