The Packaging Engineer is responsible for various packaging projects from initiation to production. Projects will consist of modifications of packaging for existing products as well as the packaging for new products. This includes identification, specification development, line trials, sample procurement, sizing trials, line troubleshooting, product documentation, cost-reduced packaging, etc.
In this role, the selected candidate must possess knowledge and skill with one or more of the following types of software: Siemens Controllers; C++; CATIA; SolidWorks; 3DVIA; Abaqus; Calculix; Code Aster; Delmia; GetFEM++; DIANA FEA; etc.
This position will provide Engineering support for wafer level packaging development and production operations. The ideal candidate for this position will have a thorough understanding of the principals involved in semiconductor wafer processing and a strong background in semiconductor electrical engineering.
In this role, you will be responsible for
estimates and coordinates resources needed (materials, budget, time and people) to accomplish assigned individual tasks. Anticipates future directions. Benchmarks internally and externally. Recognizes changes in the environment and present resources as indicators of future problems and opportunities; prepares for such eventualities.