Responsible for designing opto-mechanical components, assembly and test fixtures for high power semiconductor laser arrays. Will be actively involved in fabrication, testing, and manufacturing support.
The selected candidates primary responsibility is to support ongoing efforts to expand and improve manufacturing capacities and capabilities within assigned areas of Assembly Manufacturing and Engineering departments.
Responsible for the design, the development and the application of computational finite element analysis (i.e. Ansys Fluent/Mechanical) to understand and optimize current products/systems. Knowledge of FDS (Fire Dynamics Simulator) a plus.
Transition concepts into products using 3D CAD Solid Modeling, defining requirements, selecting materials and processes, interacting with suppliers and manufacturers, and documenting the development process.
Prepare design computations and quality estimates and develops probable cost estimates for the smaller projects within the business unit. Provide drawing for own design and produce sketches to incorporate in drawings by drafters.
Design experience with thermal management solutions and sheet metal design for telecom applications; familiarity with with working with PWB design processes and system level design for telecom applications.
Important attributes include the ability to apply creative solutions to challenging mechanical problems along with designing and building benchtop size prototype hardware with the ability to scale to larger fieldable sizes.
Strong written and verbal communication skills, ability to navigate MS Office tools, web based systems and quickly learn and adapt to complex systems and product independencies to accomplish pointed tasks is an absolute requirement.