As a Package design engineer you will be responsible for early form factor component fit studies, die escape strategies, power delivery development and implementation, ball map creation, signal assignment, die interface co-design, and point to point routing of high speed interfaces.
In this role, you will influencing new package technology design, process and material decisions through the development of quality and reliability risk assessments leveraging historical data, analytical modelling capabilities and fundamental technical knowledge.
In this role, you will be responsible for the thermal/mechanical/electrical design, analysis, and development of electronic packages. Defines overall package performance and specification and realizes technology certification through layout design and test vehicle design.
Provides consultation concerning packaging problems and improvements in the packaging process. Responds to customer/client requests or events as they occur. Develops solutions to problems utilizing formal education and judgment.
In this role, the selected candidate will work cooperatively with process development, quality, manufacturing, regulatory and marketing to ensure project success; coordinate documentation of work instructions for new packaging configurations.
The Packaging Engineer will be responsible for leading the successful development and implementation of new packaging designs, executing tests and ensuring appropriate industry and corporate standards are met.