Work with internal design, modeling and procurement teams to implement technically best and lowest cost SIP options. oTechnical program management to plan, execute, and monitor complex process or product developments. Regular updates on program status to management.
A Candidate will work with circuit designers, substrate manufacturers, material & equipment suppliers, packaging production facility, reliability engineering, and customer to define packaging roadmaps and develop assembly technology to meet objectives for cost, reliability, and manufacturability.
In this role, the selected candidate will be
responsible for developing new assembly technologies, running process DOEs, identifying new materials and equipment, reliability testing, and qualification of new assembly process.