Candidate will work with circuit designers, material suppliers, internal and external manufacturing facilities, and reliability engineering to define and develop MCM and leadframe packages and assembly technology to meet critical objectives for cost, reliability, and manufacturability.
Lead or assist in the design, development, and testing of high visibility, complex packaging projects from ideation and conceptual design through design/technology transfer and implementation readiness. Design and development includes identification of packaging design or user requirements, research and selection of packaging materials, suppliers, and technologies, and the test artwork development process. Lead and or assist with packaging lifecycle changes, initiatives, process improvements, etc.
In this role, the selected candidate must have excellent knowledge of the materials used in construction, manufacture, print production, decorating techniques and materials used on primary, secondary, and tertiary packaging.