Design of electronic packaging chassis and structures, interconnects, thermal control design of high density electronic systems and electronic enclosures, adhere to design constraints of Size, Weight and Power, design to cost.
Implements new processes in working with high energy, cross functional New Product Introduction team environment which includes Pilot Production, Advanced Manufacturing Engineering, Operations, Quality and R&D.
Develops and manages project schedules to ensure deadlines are met.Creates project budgets and recommends necessary resources. Optimizes product, process, tooling and/or equipment design to produce cost-effective, quality results within design specifications.
Primary job responsibilities is to perform conceptual and detailed mechanical design of High density Electronic packaging designs and Electronic components / devices for application in space applications and airborne defense.
Prepares evaluation reports, analyzes discrepancies, makes recommendations for and initiates the most cost effective improvements for test equipment, procedures, or operating processes that improve productivity and quality and reduce process time.
This position will also support existing products, customer interface and meetings, and modification of existing designs for custom applications; design duties will include all aspects of sensor design including conceptual, preliminary, and detailed design tasks.
This position is responsible for a variety of engineering responsibilities. Uses knowledge of engineering discipline, processes and tools in order to complete and ensure compliance of various project subtasks.