In this role, the selected candidate must have experience developing a sales strategy, including the techniques and tactics based on customer feedback and market environment, and in business development activities including prospecting, networking, and partnering.
This position will provide Engineering support for wafer level packaging development and production operations. The ideal candidate for this position will have a thorough understanding of the principals involved in semiconductor wafer processing and a strong background in semiconductor electrical engineering.
In this role, the selected candidate will be responsible for planning, development, testing, and implementation of SAP customizations and upgrades; contribute to testing, risk analysis, group presentations, status reporting, and more.
In this role, the selected candidate will be responsible for manufacturing tool automation and data systems on the factory floors across the backend sites including alignment of solutions and processes.
In this role, the selected candidate will configure, develop, maintain and support Micron and third party applications; create and analyze software specifications, and research, design, document, modify, and support software throughout the development life cycle.
In this role, the selected candidate must have experience with semiconductor process development is required in one or more of following areas: PVD, CVD, photolithography, plating, CMP, dry etch, or wet process.
In this role, the selected candidate will transfer processes to pilot production and high volume manufacturing facilities; improve existing processes and enhance process capability, productivity and efficiency.
In this role, the selected candidate will be responsible for managing package construction analysis together with package failure analysis; providing feedback and direction to equipment suppliers for equipment improvement.
In this role, the selected candidate will provide ownership for both process development & related tool issues for specific films & processes; responsible for incorporating these processes into high density advanced memory parts.