You will be responsible for the development of memory-test patterns, analyzing electrical failures, improvement of yield and of overall cell performance, debug, design, simulation and implementation of circuit and process changes on test chips.
Your job duties will include wafer and component level circuit debug, device characterization for improved operation and testability, and detailed DRAM analysis to maximize end-user performance and reliability.
You will be responsible for developing SAP software applications in the Contract Manufacturing, Back End/Finished Goods and Logistics domains and contribute to all software development related activities.
In this role, you will work with Account Management to determine where the opportunity fits within the scope of our ability to engage, given available resources (align supplier strengths to meet the customer needs).
As an Electrical Design Engineer at Micron Technology Inc., you will be a key contributor in a team environment, bringing new ideas to solve a variety of testing challenges. You will be performing system architectural design, logic design, and digital and analog circuit design.
Provide daily ongoing support for multiple client networks both onsite and remotely by managing computers, users and domains, providing hardware and software installation, maintaining onsite and offsite backups, maintaining antivirus & spam solutions, and troubleshooting problems.
In this position, you will work with Micron engineers and vendors to develop processes that meet device requirements for next-generation semiconductors, transfer processes to part specific R&D teams, and ultimately provide this technology for transfer to Micron's worldwide manufacturing fabs.
This position is responsible for integrating Portal with ECM, Search, Collaborations, etc., - Open Source and COTS/ legacy/3rd party integration Point-to-point, links/mash-up, Open Web Integration protocols (SOA and REST in specific).
This responsibility includes coordinating qualification efforts for new products and when new designs, materials, or processes are introduced and providing recommendations on product release based on package reliability test results.