In this role, you will research and develop specifications/requirements, structural layouts and detail designs involving composite and metallic structural materials for airframe design and integration.
In this role, the selected candidate will be responsible for participating in trade studies, creating and maintaining ICDs (interface control documents), and coordination with subcontractors and other Integrated Product Teams.
The scope of the avionics engineering team includes: flight avionics hardware; signal conditioning; data acquisition; actuator control; RF communication; wire harnesses; vehicle guidance, navigation, control; fault tolerance; ground-support electronics hardware and software; and integrated vehicle health monitoring.
Develops, evaluates, and improves manufacturing methods, utilizing knowledge of product design, materials and parts, fabrication processes, tooling and production equipment capabilities, assembly methods, and quality control standards.
Candidate will work closely with ADP team to design manufacturing plans for various programs. Duties will include the following:Facilitating lay-outs, tooling recommendations, processing documentation and validation and planning development.
Compiles and analyzes data (temperature, pressures, speed, horsepower, fuel consumption, etc.)and defines changes required in testing equipment, testing procedures, manufacturing processes, or new testing requirements.
Candidate will work closely with a team of engineers in the design, development and set-up of a manufacturing area.Duties will include: facilitating lay-outs, tooling recommendations, processing documentation and validation and planning development.
In this role, the selected candidate will ensure effective utilization of labor and equipment resources via established production standards; maintain production labor standards and routings as defined in the ERP system.
Responsibilities include CMOS design and analysis of low noise analog circuit blocks, low power analog to digital conversion, high speed RF, analog, and digital signal transmission, and concept generation of high frame rate mega-pixel infrared imaging arrays.