In this role, you will be responsible for the thermal/mechanical/electrical design, analysis, and development of electronic packages. Defines overall package performance and specification and realizes technology certification through layout design and test vehicle design.
In this role, the selected candidate will work cooperatively with process development, quality, manufacturing, regulatory and marketing to ensure project success; coordinate documentation of work instructions for new packaging configurations.
In this role, you will be responsible for
drive R&D activities for various engineering projects that will allow the achievement of project goals and objectives through the implementation of new and/or improved packaging designs and processes.
In this role, you will influencing new package technology design, process and material decisions through the development of quality and reliability risk assessments leveraging historical data, analytical modelling capabilities and fundamental technical knowledge.
This position will provide Engineering support for wafer level packaging development and production operations. The ideal candidate for this position will have a thorough understanding of the principals involved in semiconductor wafer processing and a strong background in semiconductor electrical engineering.